TSV Series



Desktop Dispensing System

Data Sheet

TSV Series desktop dispensing system is applicable for underll, LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, ngerprint identication module, etc. at SMT & PCB assembly, semiconductor package, electromechanical
assembly and at-panel-display assembly.

TSV-300 model is 300 x 300 mm on working platform.


Standard Features 

Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
ESD grounding point-
CE certied


Optional Features 

Automatic constant temperature system to ensure the uidity consistent
Laser Height Detection to calibrate Z axis automatically for component


System Specifcations

Dispensing Parameters
Standard Work Area

X 300 × Y 300 mm

(X 11.81“ × Y 11.81“)

Maximum Components Height 95 mm (3.74”)
Operation Height Level 950 ± 20 mm (37.40" ± 0.79")
Number of Valve 1 set
Nozzle Cleaner Vacumm nozzle cleaning



Transmission System
Number of Axes X, Y, Z axis
Driver Servo motor
Maximum Moving Speed 1000 mm/s
Acceleration 0.8 g
Position Accuracy 

XY : ± 0.02 mm (±0.00078”)

Z : ±0.01 mm (±0.00039”)

Repeatable Accuracy

XY : < 0.015mm (< 0.00059”) 

Z : ± 0.005mm (±0.00019”) 



Vision System
Resolution 1296 x 966 px
Pixel Size

3.75 x 3.75 μm

Light Source Combination of ring light and co-axial light



Standard Footprint

L 810 x W 660 x H 760 mm

(L 31.88” x W 25.98” x H 29,92”)

Weight 80 kg (176 lb)
Ventilation 12m3/min
Air Requirement

95 psi (0.6MPa)

Input Power AC 220 V 50/60 Hz 10 A



Controller IPC and motion controal card 
Software Anda user interface with Windows OS
Programming  On-line vision programming
Communications Protocol SMEMA